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UCC3 640 384
UCC3 640 384
UCC3 640 384
UCC3 640 384

UCC3 640 384

High-Performance Thermal Core | 640 × 384 Resolution

The UCC3 640 × 384 Thermal Imaging Module delivers high-resolution thermal data for precise detection and analysis. Designed for seamless integration, it offers stable performance across demanding environments and applications.Ideal for surveillance, industrial monitoring, and advanced thermal solutions.

  • High sensitivity for accurate temperature detection
  • Stable performance in complex environments
  • Flexible interface options for diverse applications
Applications
  • Security Surveillance
  • Industrial Inspection
  • UAV Systems
  • Smart Devices
Quick Specs
  • Resolution: 640 × 384
  • Detector Type: Uncooled VOx
  • Frame Rate: 25/30Hz
Technical Data
Specifications
Detector Parameters
Detector Type Uncooled VOx Microbolometer
Resolution 640 × 384
Pixel Pitch 17μm
Spectral Range 8 - 14μm
NETD ≤50mK @ 25°C, F#1.0
Optical Parameters
Focal Length 9mm
FOV 69° × 52°
Aperture F1.0
Focus Fixed
Image Processing
Frame Rate 25Hz
Image Enhancement Digital Detail Enhancement (DDE)
Noise Reduction Temporal + Spatial NR
Color Palettes White Hot / Black Hot / Iron / Rainbow
Interface
Video Output LVCMOS / BT.656
Communication RS-232 / RS-485
Control Serial Command Protocol
Physical
Dimensions 25mm × 25mm × 18mm
Weight ≤15g
Mounting 4× M1.6 Screw Holes
Environmental
Operating Temperature -40°C ~ +70°C
Storage Temperature -45°C ~ +85°C
Humidity 5% ~ 95%, Non-condensing
Vibration GJB150A-2009
Power
Input Voltage 3.3V DC
Power Consumption ≤1.2W (Typical)
Start Time ≤10s

High-Resolution Thermal Imaging

Delivers 640 × 384 infrared resolution, providing sharper thermal details and more accurate target detection for critical applications.

advantage

Compact & Easy Integration

Designed with a compact footprint and flexible interface, enabling seamless integration into embedded systems and industrial platforms.

advantage

Stable Performance in Harsh Environments

Built for reliability, ensuring consistent thermal imaging output under extreme temperatures, vibration, and complex field conditions.

advantage
Resources
Downloads
Interface Description USB 3.0 PORT-EN MB
Download
Interface Description MIPI-Interface-EN MB
Download
Mod Usage Manual MB
Download

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